One packaging technique of exposed MEMS sensorsLIN, Tim; YOON, Rick.SPIE proceedings series. 2002, pp 105-108, isbn 0-930815-66-1, 4 p.Conference Paper

The assessment of the impact of mask pattern shape variation on the OPC-modeling by using SEM-Contours from wafer and maskHIBINO, Daisuke; HOJYO, Yutaka; SHINDO, Hiroyuki et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 7971, issn 0277-786X, isbn 978-0-8194-8530-4, 79712G.1-79712G.9, 2Conference Paper

The package and thermal management of an infrared (IR) sensorLIN, Tim; YOON, Rick.SPIE proceedings series. 2002, pp 459-463, isbn 0-930815-66-1, 5 p.Conference Paper

Drive current enhancement in sub-50 nm CMOS by reduction of SDE resistance with laser thermal processYAMAMOTO, Tomonari; GOTO, Ken-Ichi; KUBO, Tomohiro et al.Journal of the Electrochemical Society. 2004, Vol 151, Num 12, pp G895-G899, issn 0013-4651Article

Polygenic determinants of severe hypertriglyceridemiaJIAN WANG; BAN, Matthew R; HEGELEL, Robert A et al.Human molecular genetics (Print). 2008, Vol 17, Num 18, pp 2894-2899, issn 0964-6906, 6 p.Article

Packaging and thermal management for kw/cm² r^l microwave amplifiersLIN, Tim; YOON, Rick.SPIE proceedings series. 2002, pp 313-317, isbn 0-930815-66-1, 5 p.Conference Paper

Compressive simultaneous full-waveform simulationHERRMANN, Felix J; ERLANGGA, Yogi A; LIN, Tim T. Y et al.Geophysics. 2009, Vol 74, Num 4, issn 0016-8033, A35-A40Article

Randomized marine acquisition with compressive sampling matricesMANSOUR, Hassan; WASON, Haneet; LIN, Tim T. Y et al.Geophysical prospecting. 2012, Vol 60, Num 4, pp 648-662, issn 0016-8025, 15 p.Article

Compressed wavefield extrapolationLIN, Tim T. Y; HERRMANN, Felix J.Geophysics. 2007, Vol 72, Num 5, issn 0016-8033, SM77-SM93, SUPArticle